The lithography machine is the core device in the lithography process in chip manufacturing. The technical content and value content are extremely high. The lithography machine involves a number of advanced technologies such as system integration, precision optics, precision motion, precision material transfer, and high-precision microenvironmental control. It is the highest-technical device in all semiconductor manufacturing equipment, and therefore has a very high single-unit value.
Laser: Light source, one of the core equipment of the lithography machine.
Beam Corrector: Correct the incident direction of the beam and make the beam as parallel as possible.
Energy Controller: Controls the energy that will eventually shine on the silicon wafer. Underexposed or overexposed will seriously affect the imaging quality.
Beam shape setting: Set the beam to round, ring and other shapes, different beam states have different optical characteristics.
Shutter: Blocks the beam from shining on the wafer when exposure is not needed.
Energy detector: Detects whether the final incident energy of the beam meets the exposure requirements and feeds it back to the energy controller for adjustment.
A mask plate: A glass plate engraved with a circuit diagram on the inside, costing hundreds of thousands of dollars.
Masking station: The equipment that carries the mask movement, the motion control precision reaches nano level.
Objective: The objective lens consists of more than 20 lenses. Its main role is to scale down the circuit diagram on the mask, and then it is laser-mapped on a silicon wafer. The objective lens also compensates for various optical errors. The technical difficulty lies in the difficulty of designing the objective lens and the high precision requirements.
Metering and Exposure Stations: Workstations that carry silicon wafers. General lithography machines need to measure, then expose, only one worktable. ASML's dual-stage lithography machine can achieve one wafer exposure and another silicon. Tablets for measurement and alignment work can effectively improve work efficiency.
Internal closed frame and shock absorber: isolate the work table from the external environment, maintain the level, reduce the external vibration interference, and maintain a stable temperature and pressure.
The lithography machine is generally divided into three types according to the simplicity of operation, manual, semi-automatic, fully automatic
A manual: refers to the adjustment of the alignment method, by adjusting the X-axis, Y-axis and thita angle to complete the alignment by hand-tune the knob, the accuracy of the alignment can be imagined and not high;
B semi-automatic: refers to the alignment can be adjusted by the CCD based on the electric axis;
C Automatic: Refers to the uploading and downloading from the substrate. The exposure duration and circulation are controlled by the program. The automatic lithography machine mainly meets the factory's need for throughput.
What is the use of a lithography machine?It is to make the circuit and functional area needed for chip production. The light emitted by the lithography machine is exposed to the wafer coated with the photoresist through the mask with the pattern. After the photoresist sees light, the nature changes, so that the pattern on the mask is copied onto the wafer.
The lithography machine can be widely applied to the fabrication of micro-nanostructure devices such as micro-nanofluidic wafer processing, micro-nano optical elements, micro-nano gratings, and NMEMS devices.
The lithography machine is one of the core devices for chip manufacturing and belongs to the advanced equipment made by mankind.
The world's most advanced lithography machine: EUV NXE 3350B (EUV extreme ultraviolet lithography machine), known as the ultimate weapon of the semiconductor industry, TSMC, Intel are looking forward to, the history of the most expensive "tool machine" will begin in 2017 The trial production process of seven nanometers made a great deal of power and became the main model.
With 100 million U.S. dollars and a unit price of more than 600 million U.S. dollars, we have to wait for the price of a machine to be equal to the price of an aircraft. Without it, only ASML can produce it! So why is the lithography machine so expensive?
Taiwan Semiconductor Manufacturing Co. and Intel Corp. all hope that the most expensive "machine tool" in history will begin trial production of the seven-nanometer process in 2017 and become the main model.
The world produces more than 10 billion pieces of mobile phone chips and memory each year. It has been relying on cumbersome procedures for decades, but the principle is similar to the production of exposure and development processes for photographic processing.
Among them, a lithography machine that projects a circuit pattern is the most critical and most expensive. Over the past decade or so, the world's most advanced micromirrors have used deep ultraviolet light at a wavelength of 193 nanometers. However, the most advanced transistors produced by Intel and Taiwan Semiconductor Co., Ltd. have been sized to be as small as tens of nanometers. This is similar to using the same pen, and the word to be written is getting smaller and smaller. The final tip of the pen is more dilemma than the word to be written.
To replace the "ultra-fine word pens," the technology is derived from the US "Revolutionary era" "Star Wars Plan" with a wave length of only 13 nanometers. According to Intel's main promoter, it plans to go into battle in 2005. The production schedule is delayed and extended.
Because this technology is too difficult. EUV light energy is highly destructive, and all parts and materials of the process are challenging the limits of human processes. For example, because air molecules interfere with EUV light, the production process is in a vacuum environment. Moreover, the motion of the machine is so accurate that the error is only measured in picoseconds (milliseconds).
One of the most critical parts, the mirror produced by ZEISS, Germany, was unparalleled in history, and its size was only measured in picometers (one thousandth of nanometers).
What is the concept of this? Peter Wennink, president and CEO of ASML, explained in an exclusive interview with “The World†that if the area of ​​the mirror is all over Germany, the highest protrusion cannot be higher than one centimeter.
"Meeting this kind of (crazy) requirement is our day-to-day work," says Wen Peter, who took over as chief executive two years ago.
Because EUV's technical difficulty and the amount of investment needed are too high, two other lithography equipment manufacturers, Nikon and Canon in Japan, have given up development. ASML has become the last hope for the semiconductor industry to continue spurring the next generation of advanced processes and developing more power-efficient and faster-speed transistors.
So far, the company that can produce this high-end lithography machine has occupied a market share of 80% and monopolized the high-end lithography machine market.
Maintenance is better than maintenance, daily maintenance is very important, the maintenance of lithography machine:
1. Clean each cooling fan once a week with compressed air.
2. Clean the interior of the machine more thoroughly every week.
3, regular maintenance
4, rails and screws monthly grease.
5. Replace the spindle coolant every six months.
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