Infineon Technologies has developed the thin surface mount package "ThinPAK 5x6" for the high-voltage power MOSFET "CoolMOS". The package area is 5mm × 6mm, the thickness is only 1mm, and the size is small and thin.
Infineon previously released the surface mount package "ThinPAK 8x8" for 8mm x 8mm for server and long-distance communication. This new product is the follow-up product for chargers and tablets for mobile products. TV and LED lighting appliances, etc.
The ThinPAK 5x6 is 80% smaller than the existing package "DPAK" and has a smaller parasitic inductance than DPAK. Taking the source inductor as an example, the DPAK is 4.7nH, while the ThinPAK 5x6 is only 1.6nH, which can reduce the overshoot during switching.
The ThinPak 5x6 package is currently sampling and is scheduled for volume production in September 2014.
Infineon previously released the surface mount package "ThinPAK 8x8" for 8mm x 8mm for server and long-distance communication. This new product is the follow-up product for chargers and tablets for mobile products. TV and LED lighting appliances, etc.
The ThinPAK 5x6 is 80% smaller than the existing package "DPAK" and has a smaller parasitic inductance than DPAK. Taking the source inductor as an example, the DPAK is 4.7nH, while the ThinPAK 5x6 is only 1.6nH, which can reduce the overshoot during switching.
The ThinPak 5x6 package is currently sampling and is scheduled for volume production in September 2014.
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