Hole metallization-double-sided FPC manufacturing process
The hole metallization of flexible printed boards is basically the same as that of rigid printed boards.
In recent years, instead of electroless plating, a direct electroplating process using the technology of forming a carbon conductive layer has appeared. The hole metalization of flexible printed boards also introduces this technology.
Flexible printed boards need special fixing fixtures because of their softness. The fixtures can not only fix the flexible printed boards, but also must be stable in the plating solution, otherwise the thickness of the copper plating will be uneven, which will also cause disconnection during the etching process. And the important reason for bridging. In order to obtain a uniform copper plating layer, the flexible printed board must be tightened in the fixture, and work must be done on the position and shape of the electrode.
Hole metallization outsourcing processing should be avoided as much as possible to factories without flexible printed board drilling experience. If there is no dedicated electroplating line for flexible printed boards, the quality of hole forming cannot be guaranteed.
Cleaning the surface of copper foil-FPC manufacturing process
In order to improve the adhesion of the resist mask, the surface of the copper foil should be cleaned before coating the resist mask. Even such a simple process requires special attention for flexible printed boards.
Generally, there are chemical cleaning process and mechanical polishing process for cleaning. For the manufacture of precise graphics, most occasions are combined with two kinds of clearing processes for surface treatment. Mechanical polishing uses the method of polishing. If the polishing material is too hard, it will damage the copper foil, and if it is too soft, the polishing will be insufficient. Generally, nylon brushes are used, and the length and hardness of the brushes must be carefully studied.
Use two brushing rollers, placed on top of the conveyor belt, the direction of rotation is opposite to the belt conveying direction, but if the brushing roller pressure is too large at this time, the substrate will be stretched under great tension, which causes dimensional changes One of the important reasons.
If the surface of the copper foil is not clean, the adhesion to the resist mask will be poor, which will reduce the pass rate of the etching process. Recently, due to the improvement of the quality of copper foil boards, the surface cleaning process can also be omitted in the case of single-sided circuits. However, surface cleaning is an indispensable process for precision patterns below 100μm.
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