At this stage, the wireless connection market is developing rapidly and the market scale is expanding. The main driving force is the explosive growth of mobile devices and Internet of Things applications. RF front-end chips play a key role in wireless connectivity. Currently, GaAs or SiGe processes are mainly used. However, due to the scarcity of materials and the complexity of the process, the yield of RF front-end chips is not high, and RFaxis adopts industry-standard Bulk CMOS technology manufactures RF front-end chips that increase RF front-end chip production and reduce costs.
CMOS process has great advantages
RFaxis' product line is mainly based on wifi and some IoT applications. The company has several patents.
The main product of RFaxis is RFIC, which is mainly used in the RF front-end part. The main function of the RF front-end is to connect the RF receiver and antenna to increase the output power, improve the receiving sensitivity, increase the transmission rate and distance. Traditional RFICs consist of separate PAs, LNAs (low noise amplifiers), SWITCHs (switches), and discrete devices that are combined in a single module using a GaAs process. In addition, there are products using the SiGe process, but similarly, the integration is much lower than that of pure CMOS process products.
"X-rays have found that competitors' products have two dies in at least one chip. These dies are connected by wire bonding, and our chips are composed entirely of a single dies, and this performance Will be more optimized," said Raymond Biagan, vice president of global sales at RFaxis.
Figure 1 Chip X illumination comparison
RFaxis claims to be the only company in the world that can produce RFICs in pure CMOS processes. At the same time, chips produced in CMOS process have comparable performance to competitors including Avago and Qorvo (a new company after the merger of RFMD and Triquint). . And because it is produced in a pure CMOS process, the product is superior to the GaAs process in both process and lead time.
Biagan said: "Summary, the advantages of our products are: a lower cost; two higher integration; three beyond the performance of competitors; four better ESD protection performance, because the CMOS process is more conductive The operating temperature is also higher; the external circuit of the five customers is simpler, the customer is easier to develop, and the system cost is lower."
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