For the rapid development of backlight products, Hongli Optoelectronics has launched the X-CHIP 2016 series of high-performance, 1W~3W high-power packaging devices, which can be widely used in various backlight products, especially TV backlights and flat panel display backlights. Mobile phone flash and Other applications.
X-CHIP 2016 products adopt Flip-Chip packaging technology, and the flip chip has the advantages of large illumination angle, small package size and high light efficiency, and shortens the product process, improves product yield and reliability compared with traditional package products. High and has a good operating life. With its slim design (2.0mm × 1.6mm × 0.8mm), it has the advantages of large luminous surface and ultra-fast heat dissipation.
With its leading white LED packaging technology, Hongli Optoelectronics continues to provide customers with high-quality LED devices, and at the same time consider cost factors, launch this high-performance patch LED 2016 for backlight, improve backlight thickness and reduce Province 15~20% backlight cost. The main color gamut is 0.275±0.025/0.245±0.015, and the luminous flux can reach 210lm. The product is in compliance with RoHS environmental protection regulations. Hongli Optoelectronics plans to achieve mass production in Q2 and will continue to increase production capacity.
Hongli Optoelectronics Co., Ltd. is the leader of domestic white LED packaging devices. Based on the development idea of ​​“promoting production through research and development and guiding consumption by productsâ€, the company actively develops high-quality LED packaging products and optimizes cost performance to ensure product stability. Long life and luminous efficacy. At the same time, Hongli Optoelectronics set up a professional R&D and marketing team for different application fields, providing customers with cost-effective packaging products and comprehensive solutions. Hongli Optoelectronics has an LED packaging production base with a construction area of ​​100,000 square meters. Its quality, capacity and delivery have unparalleled advantages.
X-CHIP 2016 products adopt Flip-Chip packaging technology, and the flip chip has the advantages of large illumination angle, small package size and high light efficiency, and shortens the product process, improves product yield and reliability compared with traditional package products. High and has a good operating life. With its slim design (2.0mm × 1.6mm × 0.8mm), it has the advantages of large luminous surface and ultra-fast heat dissipation.
With its leading white LED packaging technology, Hongli Optoelectronics continues to provide customers with high-quality LED devices, and at the same time consider cost factors, launch this high-performance patch LED 2016 for backlight, improve backlight thickness and reduce Province 15~20% backlight cost. The main color gamut is 0.275±0.025/0.245±0.015, and the luminous flux can reach 210lm. The product is in compliance with RoHS environmental protection regulations. Hongli Optoelectronics plans to achieve mass production in Q2 and will continue to increase production capacity.
Hongli Optoelectronics Co., Ltd. is the leader of domestic white LED packaging devices. Based on the development idea of ​​“promoting production through research and development and guiding consumption by productsâ€, the company actively develops high-quality LED packaging products and optimizes cost performance to ensure product stability. Long life and luminous efficacy. At the same time, Hongli Optoelectronics set up a professional R&D and marketing team for different application fields, providing customers with cost-effective packaging products and comprehensive solutions. Hongli Optoelectronics has an LED packaging production base with a construction area of ​​100,000 square meters. Its quality, capacity and delivery have unparalleled advantages.
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