With the support of the new generation of broadband wireless communication industry and integrated circuit industry, the country has made major breakthroughs from “coreless†to “coreâ€, and a number of design companies that have begun to compete internationally have emerged. The technology gap between top companies is shrinking. The official issuance of 4G licenses in 2013 has provided a good development environment for the domestic mobile chips to achieve innovative upgrades from “core†to “strong coreâ€.
In terms of communication chips, in the first three quarters of 2011, 2012 and 2013, China's mobile phone baseband chip shipments were 393 million, 462 million, and 437 million, respectively. The localization rate doubled within 3 years, accounting for more than 23%. In terms of LTE chips, China has basically kept up with the international level. At present, Haisi, Spreadtrum, Lianxin, ZTE Microelectronics, Chuangyi Video, Repost, and National Technology have realized the commercial supply of LTE baseband chips. Many companies such as HiSilicon and Spreadtrum have developed R&D of TD-LTE, TD-SCDMA, FDD LTE, GSM and WCDMA five-mode chips, and adopted the most advanced 28nm process design. In 2014, many platforms can be commercialized. The development of LTE-Advanced multimode chips is currently underway and it is expected that test samples will be released in 2014.
In the application processing chip, China's smartphone application processing chip shipments in the first three quarters of 2011, 2012 and 2013 were respectively 97 million, 258 million and 318 million, and the localization rate has reached 25%. The growth trend is obvious. At the same time, the single chip of integrated communication baseband and application processor provided by Spreadtrum and Lianxin is an important force to drive development. It is worth mentioning that domestic enterprises have gradually deepened their understanding of the infrastructure. Haisi is becoming the first enterprise in China to obtain the authorization for ARM architecture. In addition, Jun is based on the MIPS instruction set designed processor architecture, has been widely used in the field of educational electronic equipment (accounting for 45% of the domestic market), and is gradually developing into the fields of smart phones, tablets and wearable devices.
Objectively speaking, under the current industrial structure, China's mobile chips must achieve further breakthroughs and upgrades, and still face enormous challenges in market expansion, technology improvement, and industrial cooperation.
First of all, the gap between the strength of most domestic enterprises and the international leading enterprises is large. The products are mainly in the middle and low-end markets, and the profit margin is low. At present, the giants and other giants are entering the low-end market to squeeze the living space. The future will follow the design technology. And the difficulty of upgrading the process technology will increase the risk of the gap being widened again.
Secondly, the development needs of large bandwidth, high speed, high performance and low power consumption need to introduce 28nm or higher technology. At present, there are only a small supply of 28nm chip products in China. In addition, domestic enterprises generally lack the development and accumulation of basic functions such as CPU, GPU, and DSP. The manufacturing enterprises are seriously deficient in the accumulation of process IP.
Finally, the interaction space between mobile chips and local integrated circuit manufacturing is still huge. For example, SMIC's 40nm process can only support about 20% of domestic manufacturers' capacity requirements. 28nm has not yet entered mass production stage and cannot meet new products of domestic enterprises. R&D needs.
What needs to be seen is that while facing severe challenges, there are several important opportunities for the future upgrade of China's mobile chip technology.
First, China's communications industry has entered the 4G era. On December 4, 2013, the Ministry of Industry and Information Technology officially issued 4G licenses to the three major operators, which indicates that China's communications industry has entered a new era of 4G. The launch of the world's largest LTE market has created a good upgrade for China's mobile chip technology and industry. Development Environment.
Second, mobile intelligent terminals will continue to flourish. The status of domestic terminal enterprises in the global industry is rapidly increasing. Huawei, Lenovo and ZTE have entered the top ten in the world. In the mainstream and entry-level markets, Chinese enterprises have become the main force of innovation. The huge domestic market advantage and terminal capacity advantage have created more development opportunities for the subsequent chip companies and terminal enterprises to deepen cooperation and increase the localization rate of chips.
Third, the foundation for the development of China's mobile chip industry has been laid. After years of development, domestic mobile chip companies have made certain breakthroughs and accumulations in technology and market, and actively participated in the competition and cooperation in the international market. While the global industrial status has been improved, they are also rapidly following up the global technology development trend. Forming good cooperative relations with international giants, such as cooperation between Qualcomm and SMIC, Spreadtrum and TSMC, will lay a good foundation for better reference and utilization of international advantageous resources and improvement of their competitive strength in the future.
In the 4G era, grasping new opportunities for industrial upgrading
The arrival of the 4G era is bringing a rare and significant development opportunity to the mobile chip industry. Faced with this opportunity, China's mobile chip industry should make full use of market advantages, strengthen the layout of mobile chip technology and industry, promote collaborative innovation in all aspects of the industry chain, and realize the further upgrade of China's mobile chip technology and industry.
First, give full play to the advantages of the local market and promote the rapid expansion of the scale of the mobile chip industry. Give full play to the industrial pull effect of mobile Internet and smart terminals, encourage operators to collect and use domestic chips in the development of terminal enterprises, and accelerate the localization of mobile chips in the domestic demand market. Advance the use of mobile chips in emerging areas such as wearable smart terminals, smart TVs, the Internet of Things, and cloud computing servers.
The second is to break through the key technologies and consolidate the core technology foundations of multi-mode multi-frequency, high-performance, high-tech chip design and manufacturing. Continue to strengthen the development of LTE and LTE-Advanced multi-mode multi-frequency chips, multi-core parallel architecture and 64-bit architecture chips, integrated single-chip. Increase support for the development of state-of-the-art process commercial chips. Promote in-depth R&D and customization of ARM infrastructure, strengthen independent research and development of key IP cores such as DSP, GPU, USB, HDMI interface, and encourage the exploration of industrial ecology based on MIPS architecture.
The third is to strengthen industry linkages and achieve synergistic progress in key aspects such as mobile chip design and manufacturing. Joint chip design and manufacturing companies jointly develop the basic technology of 20nm and higher process technology; promote the realization of special processes such as simulation and MEMS. Encourage domestic enterprises to realize intellectual property sharing in various ways, encourage design and manufacturing companies to deepen cooperation, realize research and development of featured process products, and promote the participation of “chips and complete machinesâ€, “chip design and manufacturingâ€, and “IP core and chip designâ€. Resource coordination, optimization and close cooperation between entities.
Fourth, give full play to the state's policy support and guidance, and further strengthen support and coordination of core technology research and development, key equipment procurement, and core patent authorization. Optimize the industrial environment, explore and adjust existing investment, talents, and R&D mechanisms for mobile chip and integrated circuit development needs; encourage industry funds and venture capital to increase support for SMEs, actively explore new technologies and new directions, and promote domestic enterprises. M&A and cooperation; expand the listed financing channels of chip manufacturing companies and attract more capital.
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