1. LED chip inspection microscopic examination:
Whether the surface of the material has mechanical damage and pitting (whether the size of the lockhill chip and the electrode size meet the requirements of the process, whether the electrode pattern is complete
2. LED expansion film Because the LED chip is still arranged with a small close spacing (about 0.1mm) after dicing, it is not conducive to the operation of the post-process. We use a film expander to expand the film of the bonded chip, and the distance between the LED chips is stretched to about 0.6 mm. It can also be manually expanded, but it is easy to cause problems such as chip falling waste.
3. LED Dispensing Silver glue or insulating glue on the corresponding position of the LED bracket. (For GaAs, SiC conductive substrates, red, yellow, and yellow-green chips with back electrodes, silver paste is used. For blue and green LED chips of sapphire insulated substrates, insulating paste is used to fix the chips.) In the control of the amount of dispensing, there are detailed technical requirements in the height of the glue and the position of the dispensing. Since silver glue and insulating glue have strict requirements in storage and use, the wake-up, stirring and use time of silver glue are all matters that must be paid attention to in the process.
4. The LED preparation glue is opposite to the dispensing glue. The glue preparation is to apply the silver glue on the back electrode of the LED, and then install the LED with the silver glue on the back on the LED bracket. The efficiency of the preparation glue is much higher than that of the dispensing, but not all products are suitable for the preparation process.
5. LED manual spurs will be placed on the fixture of the thorn tablet after the expansion of the LED chip (with or without glue), the LED bracket is placed under the fixture, and the LED chips are punctured one by one under the microscope. on. Hand-made thorns have an advantage over automatic loading, making it easy to replace different chips at any time, for products that require multiple chips.
6. LED automatic loading and unloading is actually a combination of two steps of glue (dispensing) and mounting the chip. First, put silver glue (insulating glue) on the LED bracket, then use the vacuum nozzle to suck up the LED chip. Move the position and place it on the corresponding bracket position. In the process of automatic loading, the equipment should be familiar with the operation and programming of the equipment, and at the same time adjust the glue and installation accuracy of the equipment. In the selection of the nozzle, the bakelite nozzle should be used as much as possible to prevent damage to the surface of the LED chip. In particular, the blue and green chips must be made of bakelite. Because the steel nozzle will scratch the current diffusion layer on the surface of the chip.
7. The purpose of LED sintering and sintering is to cure the silver paste. The sintering requires monitoring the temperature to prevent batch defects. The temperature at which the silver paste is sintered is generally controlled at 150 ° C and the sintering time is 2 hours. According to the actual situation, it can be adjusted to 170 ° C for 1 hour. The insulating glue is generally 150 ° C for 1 hour.
The silver-glued sintering oven must be opened and replaced with a sintered product within 2 hours (or 1 hour) according to the process requirements, and should not be opened at will. Sintering ovens must not be used for other purposes to prevent contamination.
8. The purpose of LED pressure welding and welding is to lead the electrode to the LED chip to complete the connection of the inner and outer leads of the product. There are two kinds of LED pressure welding processes: gold wire ball bonding and aluminum wire pressure welding. The picture on the right is the process of aluminum wire bonding. First, press the first point on the electrode of the LED chip, then pull the aluminum wire over the corresponding bracket, and press the second point to tear the aluminum wire. The gold wire ball bonding process burns the ball before the first point, and the rest of the process is similar. Pressure welding is a key link in LED packaging technology. The main requirements of the process are the pressure welding of gold wire (aluminum wire) arch shape, solder joint shape, and tensile force.
9.LED sealant
LED packaging is mainly a little glued, potted, molded. Basically, the difficulty of process control is bubbles, lack of materials, and black spots. The design is mainly for the selection of materials, and the combination of good epoxy and brackets is selected. (General LEDs cannot pass the air tightness test)
9.1 LED dispensing:
TOP-LED and Side-LED are available in dispensing packages. Manual dispensing requires a high level of operation (especially white LEDs). The main difficulty is the control of the amount of dispensing, as the epoxy thickens during use. The dispensing of white LEDs also has the problem of phosphor precipitation leading to chromatic aberration of light.
9.2LED potting package
The lamp-LED package is in the form of a potting. The potting process is to first inject liquid epoxy into the LED molding cavity, then insert the pressure-bonded LED bracket into the oven to cure the epoxy, and then remove the LED from the cavity to form.
9.3LED Molded Package Put the pressure-welded LED bracket into the mold, mold the upper and lower molds with a hydraulic press and vacuum, and put the solid epoxy into the inlet of the injection line and press it into the mold rubber channel. The epoxy enters each LED forming groove along the glue path and solidifies.
10. LED curing and post-curing curing refers to the curing of the encapsulating epoxy. The general epoxy curing condition is 135 ° C for 1 hour. The molded package is typically at 150 ° C for 4 minutes. Post-cure is to allow the epoxy to fully cure while thermally aging the LED. Post-cure is important to increase the bond strength of the epoxy to the support (PCB). The general conditions are 120 ° C for 4 hours.
11. LED cutting and dicing Because LEDs are connected together in production (not single), Lamp packaged LEDs use cutting ribs to cut off the ribs of the LED bracket. SMD-LED is on a PCB board and requires a dicing machine to complete the separation.
12. LED test test the photoelectric parameters of the LED, check the external dimensions, and sort the LED products according to customer requirements.
Whether the surface of the material has mechanical damage and pitting (whether the size of the lockhill chip and the electrode size meet the requirements of the process, whether the electrode pattern is complete
2. LED expansion film Because the LED chip is still arranged with a small close spacing (about 0.1mm) after dicing, it is not conducive to the operation of the post-process. We use a film expander to expand the film of the bonded chip, and the distance between the LED chips is stretched to about 0.6 mm. It can also be manually expanded, but it is easy to cause problems such as chip falling waste.
3. LED Dispensing Silver glue or insulating glue on the corresponding position of the LED bracket. (For GaAs, SiC conductive substrates, red, yellow, and yellow-green chips with back electrodes, silver paste is used. For blue and green LED chips of sapphire insulated substrates, insulating paste is used to fix the chips.) In the control of the amount of dispensing, there are detailed technical requirements in the height of the glue and the position of the dispensing. Since silver glue and insulating glue have strict requirements in storage and use, the wake-up, stirring and use time of silver glue are all matters that must be paid attention to in the process.
4. The LED preparation glue is opposite to the dispensing glue. The glue preparation is to apply the silver glue on the back electrode of the LED, and then install the LED with the silver glue on the back on the LED bracket. The efficiency of the preparation glue is much higher than that of the dispensing, but not all products are suitable for the preparation process.
5. LED manual spurs will be placed on the fixture of the thorn tablet after the expansion of the LED chip (with or without glue), the LED bracket is placed under the fixture, and the LED chips are punctured one by one under the microscope. on. Hand-made thorns have an advantage over automatic loading, making it easy to replace different chips at any time, for products that require multiple chips.
6. LED automatic loading and unloading is actually a combination of two steps of glue (dispensing) and mounting the chip. First, put silver glue (insulating glue) on the LED bracket, then use the vacuum nozzle to suck up the LED chip. Move the position and place it on the corresponding bracket position. In the process of automatic loading, the equipment should be familiar with the operation and programming of the equipment, and at the same time adjust the glue and installation accuracy of the equipment. In the selection of the nozzle, the bakelite nozzle should be used as much as possible to prevent damage to the surface of the LED chip. In particular, the blue and green chips must be made of bakelite. Because the steel nozzle will scratch the current diffusion layer on the surface of the chip.
7. The purpose of LED sintering and sintering is to cure the silver paste. The sintering requires monitoring the temperature to prevent batch defects. The temperature at which the silver paste is sintered is generally controlled at 150 ° C and the sintering time is 2 hours. According to the actual situation, it can be adjusted to 170 ° C for 1 hour. The insulating glue is generally 150 ° C for 1 hour.
The silver-glued sintering oven must be opened and replaced with a sintered product within 2 hours (or 1 hour) according to the process requirements, and should not be opened at will. Sintering ovens must not be used for other purposes to prevent contamination.
8. The purpose of LED pressure welding and welding is to lead the electrode to the LED chip to complete the connection of the inner and outer leads of the product. There are two kinds of LED pressure welding processes: gold wire ball bonding and aluminum wire pressure welding. The picture on the right is the process of aluminum wire bonding. First, press the first point on the electrode of the LED chip, then pull the aluminum wire over the corresponding bracket, and press the second point to tear the aluminum wire. The gold wire ball bonding process burns the ball before the first point, and the rest of the process is similar. Pressure welding is a key link in LED packaging technology. The main requirements of the process are the pressure welding of gold wire (aluminum wire) arch shape, solder joint shape, and tensile force.
9.LED sealant
LED packaging is mainly a little glued, potted, molded. Basically, the difficulty of process control is bubbles, lack of materials, and black spots. The design is mainly for the selection of materials, and the combination of good epoxy and brackets is selected. (General LEDs cannot pass the air tightness test)
9.1 LED dispensing:
TOP-LED and Side-LED are available in dispensing packages. Manual dispensing requires a high level of operation (especially white LEDs). The main difficulty is the control of the amount of dispensing, as the epoxy thickens during use. The dispensing of white LEDs also has the problem of phosphor precipitation leading to chromatic aberration of light.
9.2LED potting package
The lamp-LED package is in the form of a potting. The potting process is to first inject liquid epoxy into the LED molding cavity, then insert the pressure-bonded LED bracket into the oven to cure the epoxy, and then remove the LED from the cavity to form.
9.3LED Molded Package Put the pressure-welded LED bracket into the mold, mold the upper and lower molds with a hydraulic press and vacuum, and put the solid epoxy into the inlet of the injection line and press it into the mold rubber channel. The epoxy enters each LED forming groove along the glue path and solidifies.
10. LED curing and post-curing curing refers to the curing of the encapsulating epoxy. The general epoxy curing condition is 135 ° C for 1 hour. The molded package is typically at 150 ° C for 4 minutes. Post-cure is to allow the epoxy to fully cure while thermally aging the LED. Post-cure is important to increase the bond strength of the epoxy to the support (PCB). The general conditions are 120 ° C for 4 hours.
11. LED cutting and dicing Because LEDs are connected together in production (not single), Lamp packaged LEDs use cutting ribs to cut off the ribs of the LED bracket. SMD-LED is on a PCB board and requires a dicing machine to complete the separation.
12. LED test test the photoelectric parameters of the LED, check the external dimensions, and sort the LED products according to customer requirements.
With 15+ years manufacturing experience for phone accessories.
Supply various portable charger for iPhone, Airpods, laptop, radio-controlled aircraft ,laptop, car, medical device, mobile device, ect.
Avoiding your devices run out of charge, portable chargers to keep your mobile device going.
From the original ordinary power bank charger to wireless power bank, green energy solar power bank, magnetic mobile power, Portable Power Stations and other products continue to innovate.
We help 200+ customers create a custom mobile power banks design for various industries.
Portable Charger,Power Bank Charger,Mini Power Bank,Wireless Power Bank, Solar Power Bank
TOPNOTCH INTERNATIONAL GROUP LIMITED , https://www.itopnoobluetoothes.com