Mobile technology is becoming more and more diversified. Intimate products in different forms such as watches, glasses, bracelets, rings, clothes, etc., in addition to being bright and bright accessories, with the breakthrough of system miniaturization technology and the integration of application software, can make more Many intelligent functions are hidden in the original size space of objects, cleverly and naturally linking daily life information to consumers.
System-in-package (SiP) miniaturization technology can optimize the small size characteristics of wearable devices, so that the use of devices can be closer to the daily use situation. For example, in the past, the concept of wearable displays equipped with micro-projection was launched more than 10 years ago, but the size of the device was too large, and the network was not yet developed and there was no suitable matching platform, so it was not a bright product at the time. Now with the miniaturized design of the SiP system, it can integrate a variety of functions on the wearable device, without changing the appearance conditions, and can increase the advantages of product portability, wireless and real-time, to create an intelligent use Value, and SiP has become the core technology of wearable devices into life.
SiP miniaturized design maximizes system space
Associate Associate of Logic SiP Business Department of Jujing Technology
At present, when designing smart wearable devices, the main challenge facing system manufacturers is how to put all the required functions into a very small space. Taking smart glasses as an example, the hardware design part needs to consider the characteristics and integration methods of the main components such as wireless communication, application processor (AP), storage memory, photographic lens, micro projection display, sensor, microphone, etc. Compatibility and overall operating performance after components are integrated on the system board. The use of SiP miniaturized system integration can simplify the system design and meet the miniaturization characteristics of the device in a multi-component integration manner. It can greatly help wearable devices that require size, weight and multi-function at the same time.
Taking the seven-in-one SiP (18 & TImes; 18 mm (mm)) and five-in-one SiP (14 & TImes; 14 mm) system chips (Figure 1) currently developed by Jujing as an example, the application processor and the third-generation dual Double data rate synchronous dynamic random access memory (DDR3), NAND, wireless local area network (Wi-Fi) and Bluetooth (Bluetooth) and other main functions, if system manufacturers use this SiP system chip, they can first overcome the small size of the product The problem. In addition, the SiP system chip that has been fully verified and fully tested can save system-side test time and gain more time for system manufacturers to focus on product differentiation.
Figure 1 The five-in-one miniaturized system chip integrates a dual-core processor, two DDR3 and two NAND.
The use of SiP system integration design can not only achieve the advantages of product miniaturization, but also the core of the system constructed by SiP design, because the main components have been integrated, it can simplify the design process for system manufacturers; if the system core is used as a design platform, then integrate After other functional components or software, multiple products can be quickly developed. For example, when the smart glasses use the 5-in-1 SiP system chip as the design core, they can use the existing design architecture to add the required functions according to the usage situation. Therefore, the extended product applications include ski-type sports glasses and firefighters disaster relief. Professional glasses or survey glasses used by military police. In addition, using the same SiP design core can also develop wearable products like other smart watch types, increasing the flexibility of product development.
Make good use of the advantages of system integration to enhance product application value
The future development highlights of wearable devices mainly depend on how to make good use of portable portability and develop an amazing user experience. Therefore, high integration of system space and application innovation are the first conditions for product success (figure 2). At present, the wearable electronic devices for sports fitness and health management that have been launched on the market have their common characteristics combined with the "ease of use", the "immediacy" of wireless transmission and the "smart service" of humanized use. In the future, as product development becomes more mature, wearable technology will also ignite applications such as industrial, medical, entertainment, security, etc., and the lightweight form factor and wireless functions will soon become the basic specifications of wearable devices. Smart wearable in the future The key to winning the device market will depend on the attractiveness of content and service applications.
Figure 2 SiP miniaturized design can integrate multiple components to gain more system space.
Therefore, when developing wearable products, both brand manufacturers and platform operators should strive for more system space and design time to increase the design flexibility advantage and rapidly develop the differentiated value of diverse products and software applications. High-integration products like smart glasses, not all system operators have the ability to design or integrate complete logic, radio frequency (RF), sensors, and micro-projection optical machines. Under the pressure of the market opportunity of the card position, if possible To solve the problem of system space, system manufacturers can focus more on the application of products and increase the market value of products (Figure 3).
Figure 3 The specifications of smart glasses are already equivalent to tablet PCs, and the application services will compete in the future.
Using SiP miniaturization technology, multiple original integrated circuits (ICs) can be integrated into a single packaged system component, reducing the printed circuit board (PCB) area occupied by the component, thereby simplifying the system space and achieving more functions, thinner and lighter Short end products. And the higher the degree of miniaturization of products, the more convenient it will create for consumers to use in large numbers, and wearable products will really become smart devices for daily life.
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