High-power density module power supply currently dominates China's industrial, communications and manufacturing industries. How to achieve low-loss and heat-dissipation balance of high-frequency power supply in the design process has become a problem faced by many manufacturers and R&D personnel. The number one question. This article will provide a brief narrative analysis of this issue to help engineers more efficiently implement low-loss, high-power power supply designs.
First of all, we take the application in the field of communication as an entry point, and specifically look at the reasons why high-power and high-density power supplies have quickly occupied the market in recent years. In the field of communication equipment design and development in China, it has always been based on low-power power supplies, which directly determines the choice of domestic manufacturers in the distribution of power supply. However, as the function of the device is continuously upgraded, the local centralized power supply mode is re-raised due to the low cost. In this situation, high-power, high-density, high-reliability module power supplies are increasingly being widely used. That is why high-density power supplies have gradually become an important market leader since 2010.
At present, the high-power module power supply used in China is generally in the form of a half-brick or full-brick package. This type of power module usually has the following characteristics: First, the high-power density power supply module adopts the internationally popular industry. Standard package, product compatibility is more extensive. Secondly, the same power and volume of the product is greatly reduced, only a quarter of the traditional products. Third, the technical indicators have been significantly improved, especially the efficiency has increased to 90%. Fourth, the product's excellent thermal design brings lower temperature rise and higher reliability.
So, how can we increase the power density of power module products during the design process? Engineers can start from the following three directions: First, engineers can use advanced circuit topology and conversion technology to achieve high power and low loss in the circuit design process. Second, engineers can reduce the volume of each component. Adapting to the new package form, the compact process structure is used to effectively reduce its volume; the third method is to improve the thermal design, making it possible to achieve heat balance under high power density conditions.
In addition, in the design of the circuit, we can also use the control algorithm and utilize the characteristics of the main power transformer and the output diode to determine the amount of power transmitted from the primary side to the isolated secondary side. Effectively reduce the power loss of high frequency module power supplies.
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