LED lamp thermal substrate technology

Heat dissipation of the heat-conducting substrate is an important part of the heat dissipation technology of the LED lamp. With the popularity of LED lamp illumination, the power of the LED lamp is also increasing, and the heat dissipation requirement becomes more urgent. Higher thermal conductivity, better processing performance and better performance-price ratio are the main directions for the development of thermal conductive substrates for LED lamps.

Generally, low-power LEDs do not have a large amount of heat, and the heat dissipation problem is not serious. Therefore, a general PCB board can be used to meet the demand. High-power LED lamps require higher thermal conductivity, heat resistance and processability due to their greater heat generation. The current LED light-conducting substrate is basically classified into a printed circuit board (PCB), a metal substrate, a ceramic substrate, and a resin substrate.

With the increasing market share of high-power LED lamps, PCBs are no longer sufficient to meet the cooling needs, so the printed circuit board is attached to a metal plate to improve its heat transfer path. Metal substrates are mostly made of aluminum or copper, which has cost advantages. Currently, LED lamp lighting products are widely used, and new metal substrates such as LED lamp copper and aluminum plates appear. However, since the metal substrate still cannot fully meet the heat dissipation requirement, the life of the LED lamp is shortened, and the ceramic substrate with better heat dissipation performance is increasingly used for the LED lamp. Ceramic substrates have excellent performance, but they are not accepted by the market because of their high price. However, with the increase in the number of purchases and the advancement of production technology, the cost and price of ceramic substrates will be reduced, and large-scale applications will not be ruled out in the future.

The resin substrate is also a promising material. According to the introduction of Shida by the NL business department of Matsushita Electric Industrial Co., the thermal conductivity of EcooLR-1586 is increased to 1.5W/m•K, and the thermal resistance is 5.0°C/W. As an organic resin-based substrate material for heat conduction, it has characteristics such as easy plasticity, higher design freedom, and low processing cost compared with a highly thermally conductive substrate material such as a metal substrate or a ceramic substrate. It also has advantages over other high thermal conductivity substrate materials in terms of withstand voltage and metal ion mobility.

LED lamp thermal substrate technology is constantly developing and progressing, but at the same time LED chip technology is also advancing rapidly. Since the LED chip photoelectric efficiency is expected to reach 200LM/W or more, then the heat dissipation requirement will be reduced, so which LED will be in the future It is still unknown that the lamp substrate has become mainstream.